Date Lecture (Tuesday) Laboratory (Friday)
Sept. 02 Introduction and cleanroom concept Lab 00:
Safety Training (if not taken already)
Step 0-1: Field/Punchthrough implant done by TA
Sept. 09 Oxidation and Process Simulation Lab 01:
Step 2: Pad oxidation and nitride deposition
Sept. 16

Lab 01 debriefing
Quiz 01
Lithography

Lab 02:
Step 3: Active area definition
Sept. 26

Lab 02 debriefing
Quiz 02
Etching

Lab 03:
Step 4: Field oxidation
Step 5: Pad Nitride strip
Step 6: Threshold implant
Sept. 30 Lab 03 debriefing
Quiz 03
Doping of Silicon

Lab 04:
Step 7: Gate oxidation and poly deposition
Step 8: Gate doping
Oct. 07

No Class - Day following Mid-autumn Festival

Lab 05:
Step 9: Gate definition
Step 10: Source/Drain implant
Oct. 14 Lab 04/05 debriefing
Quiz 04
Chemical Vapor Deposition (CVD)

Lab 06:
Step 11: Photo resist removal
Step 12: LTO deposition and densification
Step 13: Backside etch
Oct. 21 Lab 06 debriefing
Quiz 05
Metalization

Lab 07:
Step 14: Contact lithography and opening
Oct. 28 Lab 07 debriefing
Quiz 06
Isolation technique

Lab 08:
Step 15: Metal deposition
Step 16: Metal deposition
Step 17: Sintering
End of process
Nov. 04 Lab 08 debriefing
Quiz 07
Process integration

Lab 09:
Electrical measurement in 3123A
Nov. 11 Device Characterization

No scheduled lab
Nov. 18 Quiz 08
Advanced CMOS processes

No scheduled lab
Nov. 26 TBA

No scheduled lab